Founded in 2018, NEXPRO was established by a dedicated team of professionals bringing three decades of profound expertise in the semiconductor testing industry. Since its inception, the Company has focused exclusively on the research and development of probing-related applications and materials. The name “NEXPRO” combines “Next Generation” and “Probing,” embodying our corporate vision to become the premier global leader in probing materials.

The Company features an industry-leading, fully automated probe manufacturing line, with products widely deployed across third-generation semiconductors, Light Emitting Diodes (LEDs), and Vertical-Cavity Surface-Emitting Lasers (VCSELs). Driven by this highly efficient production infrastructure, we ensure a stable monthly output exceeding 200,000 premium-quality probes, comprehensively fulfilling the market’s robust demand for large-scale testing.

Furthermore, NEXPRO possesses independent R&D and manufacturing capabilities for ultra-high-precision grinding equipment. Our core product portfolio encompasses testing probes for LEDs and third-generation semiconductors, alongside ultra-fine probes with a diameter of merely 3 mils. Beyond our dedication to advanced test engineering R&D and customized application partnerships, the Company has recently expanded into advanced packaging materials. Through the strategic development of copper pillars, copper blocks, and related modules, we deliver exceptional stacking and barrier solutions for advanced semiconductor packaging.