銅塊銅柱系列
「微銅柱，大突破—引領先進封裝新時代！」
- 用於先進封裝之堆疊、雜訊隔離、導通等用途
- 客製化尺寸
- 各種銅合金材質對應 (紅銅、磷青銅、銅電鍍金…等)
- 超高外觀尺寸品質一致性
- 捲帶或瓶裝包裝出貨
材料
| Code | Element (%) | CTE (10⁻⁶K) | Thermal conductivity (W/mK) | Conductivity (%IACS) | Specific gravity |
| C5191
(Competition) |
Cu: other
Sn:5.5~7.0% P:0.03~0.35 % |
18 | 65 | 14 | 8.84 |
| C8 | Cu: other
Zn:0.2% Mg:0.15% |
17.5 | 300-330 | 76-83 | 8.9 |
| C9 | Cu: other
Sn:0.15% |
17.3 | 360 | 82 | 8.9 |
| CB | Cu99.99%
Other 0.01% |
17.7 | 391 | >99% | 8.9 |
| AC | Cu>99.99%
other 0.01% |
16.3 | >400 | >100% | 8.92 |
尺寸
| Type | Icon | Diameter/cutting surface (Φ/□) | Pad pitch | Max hight (T/L) | Tolerance Diameter | Tolerance Length |
| cylinder |  |
Φ2mm | >2.2mm | 0.65~3.0 | ±0.015 | ±0.020 |
| Φ1.5mm | >1.7mm | 0.65~3.0 | ±0.015 | ±0.020 | ||
| Φ1mm | >1.2mm | 0.80~6.0 | ±0.015 | ±0.020 | ||
| Φ0.8mm | >1mm | 0.65~6.0 | ±0.015 | ±0.020 | ||
| Φ0.4mm | 500-600um | 0.26~6.0 | ±0.010 | ±0.015 | ||
| Φ0.25mm | 350-500um | 0.16~5.0 | ±0.010 | ±0.015 | ||
| Φ0.2mm | 300-400um | 0.13~5.0 | ±0.010 | ±0.015 | ||
| Φ0.15mm | 275-350um | 0.10~1.0 | ±0.010 | ±0.015 | ||
| Φ0.12mm | 220-300um | 0.08~1.0 | ±0.010 | ±0.015 | ||
| Φ0.09mm | 150-220um | 0.08~1.0 | ±0.010 | ±0.015 | ||
| square |  |
□W0.2mm*T0.2mm | N/A | 0.2~1.0 | ±0.015 | ±0.015 |
| □W0.23mm*T0.33mm | 0.33~1.0 | ±0.015 | ±0.015 | |||
| □W0.4mm*T0.33mm | 0.4~1.0 | ±0.015 | ±0.015 | |||
| □W0.4mm*T0.4mm | 0.4~ | ±0.015 | ±0.015 | |||
| □W0.35mm*T0.35mm | 0.35~ | ±0.015 | ±0.015 | |||
| □W0.3mm*T0.7mm | 0.7~ | ±0.015 | ±0.015 |
