Micro Copper Pillars, Major Breakthrough: Pioneering a New Era in Advanced Packaging!

• Interposer Modules: Specifically designed for advanced packaging applications.

• SiP & Module Integration: Engineered for reliable stacking and electrical interconnection in System-in-Package (SiP) and module assemblies.

• Direct Stacking: Optimized for direct stacking processes to streamline production.

• Custom Dimensions: Fully customizable sizes to seamlessly integrate with client-specific pin layouts.

• Delivery Format: Supplied in standard tape-and-reel packaging, ready for automated manufacturing.