| TEMS | SPEC | UNIT | |
| General | Probing Accuracy | ±1.5@X/Y, +/- 2 @Z | um |
| X/Y | Wafer Size | Ø200, Ø300 | mm |
| Z | Moving Distance | 81 | mm |
| Chuck | Working Temp. | 20~200 | °C |
| Load Force | 300 | Kgf | |
| F | Load Force | 200 | Kgf |
| R | Moving Angle | -5.5~+3.5 | Deg |
| Loader | Single Wafer loader | 1 | EA |
| Cassette type | FOUP, FOSB, 8″ Open | ||
| Pre-aligner | 8″&12″ | ||
| Wafer ID reader | IOSS OCR Reader x1 | EA | |
| Robot | Ceramic Arm x 2 | EA | |
| Computer | O/S | Windows | 10 |
| HDD | 1TB Internal | ||
| Monitor | 17″ Touch Panel | ||
| Facilities | Power | 220V/single, 50/60Hz, Max. 3KVA (Heating) | |
| Pressure Air | 0.6~0.9Mpa | Mpa | |
| Air Consumption | 30L/min | L/min | |
| Vacuum | -60~-95kpa | Kpa | |
| Vacuum Consumption | 30L/min | L/min | |
| Main Body | Size | W1660xD1605xH1000 (H1490 with Loader) | mm |
| Weight | 2050 | kg | |
